| Processors (CPU) |
Up to 2 × 3rd Gen Intel Xeon Scalable CPUs — each CPU can have up to 40 cores.
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| Memory (RAM / Persistent Memory) |
32 DDR4 DIMM slots. - Supports RDIMM (up to ~2 TB) or LRDIMM (up to ~4 TB) RAM at 3200 MT/s. - Also supports “persistent memory” / Intel® PMem 200‑series (BPS), enabling very large memory capacity (useful for certain workloads).
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| Storage / Drive Bays (Front + Rear) |
Flexible storage configurations depending on chassis/backplane: - Up to 10 × 2.5″ SAS/SATA/NVMe drives (front), or - Up to 4 × 3.5″ SAS/SATA drives (front), or other supported bay combinations. - There are also optional rear bays (e.g. 2 × 2.5″) in certain configurations.
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| Storage Controllers / Boot Options |
Supports a range of internal RAID / storage controllers (for example: internal PERC H745, H355/H345/H755 variants, HBA options) or software RAID. Boot‑optimized subsystem (e.g. BOSS) with M.2 SSDs is supported — helps keep OS / boot drives separate from data drives.
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| I/O / Expansion / PCIe Slots |
PCIe Gen4 support — up to 3 PCIe Gen4 slots (low‑profile or full‑height depending on config), enabling high-speed add‑ons: NICs, NVMe storage, accelerator cards / GPUs (single‑width GPUs supported up to certain wattage)
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| Power Supplies & Cooling |
Multiple PSU options: redundant hot‑plug PSUs (various wattages depending on build) — supports AC or DC (depending on data‑center requirements). Cooling: air cooling standard; optional liquid cooling for high‑power configs.
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| Management & Security / Enterprise Features |
Integrated management via iDRAC9 (remote console, monitoring, firmware updates, remote management) + support for modern management frameworks (Ansible, VMware, OpenManage, etc.). Security features: signed firmware, Secure Boot, Silicon Root of Trust, TPM support, secure erase, system‑lockdown capabilities — aligning with enterprise security requirements.
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| Form Factor & Physical / Rack Compatibility |
1U chassis; height approx 42.8 mm, width ~482 mm, depth ~772–809 mm depending on bezel / rails. Well‑suited for high‑density rack deployments — good for data‑centers where space efficiency matters. |